The Engineers Blog
Engineering
Optimizing NVLink for B200 Clusters
Efficiency
Sustainable AI: Liquid Cooling
Optimizing NVLink for B200 Clusters
In this deep dive, we explore how RSP Cloud re-engineered the fabric topology for our new B200 clusters. By moving to a multi-tiered NVLink architecture, we minimized packet hop latency, allowing for massive scaling in agentic AI workloads. Key metrics show a 15% improvement in All-Reduce operations compared to standard fabric configurations.
Sustainable AI: Liquid Cooling
Air cooling is hitting its physical limits. Our Mumbai data center now utilizes direct-to-chip liquid cooling to manage the high TDP of modern GPU racks. This not only allows for higher density but also significantly reduces our PUE (Power Usage Effectiveness), contributing to RSP Cloud’s commitment to 100% green energy by 2027.